发明名称 INORGANIC FOAMED BOARD
摘要 PROBLEM TO BE SOLVED: To provide an inorganic foamed board which is extreamly low in cost, is excellent in fire resistance, imcombustibility, light-weight performance, thermal insulation property and sound insulation property and can be disposed. SOLUTION: The inorganic foamed board of 0.1-0.8 g/cm<SP>3</SP>density is formed by dissolving silicon oxide with alkali to once prepare a sodium silicate aqueous solution, adding an additive comprising boric acid or phosphoric acid to make a viscoelastic sodium silicate aqueous solution to be used as a raw material base material, mixing a solidifying agent comprising an alkali metal or an alkaline earth metal with the raw material base material to charge into a prescribed forming mold and heating at≥100°C to produce continuous pores by the evaporation and the release of water portion. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006083048(A) 申请公布日期 2006.03.30
申请号 JP20040302168 申请日期 2004.09.15
申请人 NANBU:KK 发明人 OBARA KAORU;OBARA REIKO
分类号 C04B38/00;C04B22/04;C04B22/08;C04B22/16;C04B28/26 主分类号 C04B38/00
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