| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead-free brazing structure with hazard eliminated therefrom which is a high-temperature solder alternative capable of guaranteeing the heat resistance and the joining strength to withstand the reflow treatment, and a brazing method. SOLUTION: In the lead-free brazing structure, a base 15 of an airtight terminal with a lead 12 sealed to a metal outer ring 11 with glass is joined with a circuit device 20 of a crystal piece 21 via a brazing filler metal 13 on the lead 12, and joined with a cap 25 to store the circuit element 20 via a brazing filler metal 14 on the metal outer ring 11. The brazing filler metals 13, 14 consist of first and second metal laminate plating layers, respectively, the joining strength is increased by diffusion between the metals, and the heat resistance is guaranteed. COPYRIGHT: (C)2006,JPO&NCIPI |
