| 摘要 |
PROBLEM TO BE SOLVED: To prevent the backflow of an exhaust gas and prevent a pollution due to the particles of wafers when a chamber is returned from a decompressed state to an atmospheric-pressure state in substrate processing apparatus with the airtight chamber housing the wafers under the decompressed state. SOLUTION: The substrate processing apparatus has the airtight chamber 1 housing substrates 15, a gas supply system 22 supplying the inside of the chamber with a gas, an exhaust system 26 exhausting the inside of the chamber, and a sensor 27 detecting a pressure in the chamber. The substrate processing apparatus further has a pressure relief valve 35 relieving the pressure in the chamber, and a control means 19 for controlling the pressure relief valve so as to be operated after a fixed time passes after the sensor detects an atmospheric pressure when the pressure in the chamber is returned from the decompressed state to the atmospheric pressure. COPYRIGHT: (C)2006,JPO&NCIPI
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