发明名称 POLY?PHENYLENE OXIDE? RESIN COMPOSITION, PREPREG, LAMINATES SHEET, PRINTED WIRING BOARD, AND MULTILAYER PRINTED WIRING BOARD
摘要 <p>The poly(phenylene oxide) resin composition of the invention is a poly(phenylene oxide) resin composition containing poly(phenylene oxide) and triallyl isocyanurate, wherein the poly(phenylene oxide) has a number average molecular weight in a range from 2,000 to 12,000 and the IPN structure can be formed in a cured product of the poly(phenylene oxide) and triallyl isocyanurate to provide a high heat resistance, and at the same time by using a poly(phenylene oxide) with a relatively low molecular weight, the fluidity of the melt resin can be made desirable at the time of molding to result in high molding properties.</p>
申请公布号 KR100563939(B1) 申请公布日期 2006.03.24
申请号 KR20027014276 申请日期 2002.03.11
申请人 发明人
分类号 C08L71/12;B32B15/08;B32B27/28;C08G65/48;C08J3/24;C08J5/12;C08J5/24;C08K5/00;C08K5/3477;H05K1/03;H05K3/46 主分类号 C08L71/12
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