| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To accurately bend a circuit board at a desired position without processing a base substrate itself. <P>SOLUTION: The circuit board 1 includes a base film 2, a first resist layer 9 formed on the base film 2, and a plurality of second resist layers 10, 11, 12 formed on the first resist layer 9. Each of the second resist layers 10, 11, 12 is formed on the first resist layer 9 in such a state as the layers have slit-like spacings 13, 14 each other. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
