Semiconductor component for e.g. personal computer, has circuit board on which RAM or logic chips are arranged, and intermediate layer provided between chips and circuit board, where layer is made up of heat conductive material

摘要

The component has a printed circuit board on which semiconductor components e.g. RAM or logic chips, are arranged. An intermediate layer (5) is provided between the semiconductor components and a printed circuit board, where the layer is made up of heat conductive material, which dissipates heat from the logic chip or RAM to the modular plate. The semiconductor-chip comprises of a covering and the material consists of silicate. An independent claim is also included for an electronic processing system with a semiconductor component.