发明名称 |
LAMINATED SUBSTRATE, MANUFACTURING METHOD OF SAME, AND SEMICONDUCTOR DEVICE |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laminated substrate with easiness of processing and high reliability having an optical waveguide and electric wiring. <P>SOLUTION: The laminated substrate comprises a first substrate provided with first wiring and optical waveguide, and a second substrate provided with second wiring to which the first wiring is connected and on which the first substrate is arranged. The optical waveguide is covered with an insulating layer in the circumference, and the first wiring is formed so as to penetrate the insulating layer. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
申请公布号 |
JP2006073653(A) |
申请公布日期 |
2006.03.16 |
申请号 |
JP20040253122 |
申请日期 |
2004.08.31 |
申请人 |
SHINKO ELECTRIC IND CO LTD |
发明人 |
HARUHARA MASAHIRO;YANAGISAWA KENJI |
分类号 |
H05K3/46;G02B6/122;H05K1/02 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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