| 摘要 |
<p>PURPOSE:To prevent a lead wire from being stripped off by a method wherein a slope face which is used as a bonding face for the lead wire connecting a semiconductor device to an electrode is formed on the electrode. CONSTITUTION:At an electrode 2 where a lead wire 3 connecting a semiconductor device 1 to the electrode 2 at a stem is bonded, a slope 2a which is inclined downward toward the semiconductor device 1 is formed on the electrode 2. A bonding process is executed at a conventional position, and, furthermore, the bonding process is executed at the newly formed slope. Accordingly, it is possible to prevent the lead wire 3 from being leaped upward; if the angle of the slope face is set at an appropriate value which is larger than the angle to be leaped, it is possible to place the lead wire 3 near the semiconductor device 1 or to bring the lead wire 3 into contact with the semiconductor device 1 under a preliminary pressure. By this method, it is possible to prevent the lead wire 3 from being stripped off from the semiconductor device 1.</p> |
