发明名称 Power semiconductor device for preventing punchthrough and manufacturing method thereof
摘要 This invention presents a power semiconductor for preventing punchthrough in the channel area. For this purpose, the invention presents a power semiconductor possessing a high concentration substrate area of conduction type 1 ; a primary epitaxial area of conduction type 1 , formed in low concentration on top of the drain area; a secondary epitaxial area of conduction type 1 , formed in medium concentration on top of the primary epitaxial area and with a doping profile that is actually uniform over the thickness; multiple secondary body areas of conduction type 2 , formed within the secondary epitaxial area; and two source areas of conduction type 1 , formed in high concentration along both edges of the body areas.
申请公布号 US2006049465(A1) 申请公布日期 2006.03.09
申请号 US20050202176 申请日期 2005.08.12
申请人 LITE-ON SEMICONDUCTOR CORP. 发明人 KIM JONG-MIN
分类号 H01L29/76 主分类号 H01L29/76
代理机构 代理人
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