| 摘要 |
A method of forming precision leads on a chip-supporting leadframe includes the step of having each of the leads plated at a lower side with a metal substance to directly form one or more conducting sections and outer conducting planes, such that the non-plated area of the lower side of each lead defines an inner conducting plane for electrically conductively contacting with a chip supported on a top of the leadframe. The conducting sections and the outer conducting planes directly plated on the leads have precise and stable sizes and allow the leadframe to have a reduced volume. The metal substance for plating maybe gold, silver, copper, etc., depending on actual need, so as to increase the conductivity and reduce the resistance of the leads.
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