发明名称 |
WIRING BOARD, METHOD OF MANUFACTURING THE SAME, ELECTRONIC COMPONENT, AND ELECTRONIC INSTRUMENT |
摘要 |
A wiring board includes a wiring pattern having a lands and a line connected to the land, a substrate supporting the wiring pattern, and a protective film provided over the substrate and having an opening. The land has a first portion which includes a connecting portion connected to the line and is covered by the protective film, and a second portion exposed by the opening. A hole for exposing the substrate is formed at least in the first portion of the land. |
申请公布号 |
KR100556277(B1) |
申请公布日期 |
2006.03.03 |
申请号 |
KR20030012330 |
申请日期 |
2003.02.27 |
申请人 |
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发明人 |
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分类号 |
H01L21/60;H01L23/12;H01L23/498;H05K1/11;H05K3/24;H05K3/34 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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