发明名称 WIRING BOARD, METHOD OF MANUFACTURING THE SAME, ELECTRONIC COMPONENT, AND ELECTRONIC INSTRUMENT
摘要 A wiring board includes a wiring pattern having a lands and a line connected to the land, a substrate supporting the wiring pattern, and a protective film provided over the substrate and having an opening. The land has a first portion which includes a connecting portion connected to the line and is covered by the protective film, and a second portion exposed by the opening. A hole for exposing the substrate is formed at least in the first portion of the land.
申请公布号 KR100556277(B1) 申请公布日期 2006.03.03
申请号 KR20030012330 申请日期 2003.02.27
申请人 发明人
分类号 H01L21/60;H01L23/12;H01L23/498;H05K1/11;H05K3/24;H05K3/34 主分类号 H01L21/60
代理机构 代理人
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