| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solid circuit module, in which thin electronic parts are efficiently produced at a high reliability, a lamination is easy and a high density mounting is possible. <P>SOLUTION: A solid circuit module 100 comprises a support member 110 having a surrounding frame 120 and recesses 140, 150; coated layers 160, 170 which are arranged so as to cover the upper face 120A and the lower face 120B of the frame 120 of the support member 110, and bury the recesses 140, 150, and are composed of resin materials having an adhesive force on at least a surface thereof at a low softening temperature; wiring patterns 180, 190 which are provided on the coated layers 160, 170 and have first lands 200, 230 on the frame 120 and second lands 210, 240 in the recesses 140, 150; and electronic parts 260, 270 which are connected to the second lands 210, 240, and are pushed in the coated layers 160, 170 and adhered thereto to be accommodated in the recesses 140, 150. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
