发明名称 |
METHODS AND APPARATUS FOR ATTACHING MEMS DEVICES TO HOUSING |
摘要 |
A method for increasing the bonding strength between a die (110) and a housing (202) for the die is described where a micro-electromechanical system (MEMS) device is formed on the die. The method comprises depositing a plurality of clusters (220) of contact material onto a bottom surface (240) of the housing, placing the die onto the clusters, and subjecting the housing, the clustered contacts (228), and the die to a thermocompression bonding process. |
申请公布号 |
KR20060017511(A) |
申请公布日期 |
2006.02.23 |
申请号 |
KR20057021163 |
申请日期 |
2005.11.07 |
申请人 |
HONEYWELL INTERNATIONAL INC. |
发明人 |
DCAMP JON B.;GLENN MAX C.;DUNAWAY LORI A.;CURTIS HARLAN L. |
分类号 |
B81B7/02;B81B5/00;B81B7/00;B81C3/00;G01C19/5719;H01L21/60;H01L21/603 |
主分类号 |
B81B7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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