发明名称 Radiation sensitive resin composition
摘要 A radiation sensitive resin composition which contains an alicyclic olefin resin obtained by ring-opening polymerization of a polymerizable monomer containing an alicyclic olefin monomer having carboxyl group using a ruthenium catalyst, followed by hydrogenation, an acid-generating agent, a crosslinking agent and a solvent; and a transparent resin pattern film formed on a substrate obtained by laminating a resin film formed by using the resin composition described above to the substrate, followed by irradiation with an active radiation to form a latent pattern and developing the pattern by bringing the resin film having the latent pattern into contact with a developing solution. The resin composition exhibits excellent property for development and storage stability. The transparent resin pattern film obtained from the resin composition exhibits excellent specific permittivity, transparency, dimensional stability under heating, solvent resistance and flatness and can be utilized as the resin film for electronic parts.
申请公布号 US2006040201(A1) 申请公布日期 2006.02.23
申请号 US20050534459 申请日期 2005.05.11
申请人 KURAKATA HIROSHI 发明人 KURAKATA HIROSHI
分类号 G03C1/76;G03F7/038 主分类号 G03C1/76
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