发明名称 Integrated circuit including an inductive element having a large quality factor and being highly compact
摘要 An integrated circuit including a substrate, a conductive layer, at least one inductive element superposed on the conductive layer and formed by a metallic turn having an outer contour and an inner contour, which bound between them a surface referred to as the radiation surface, and insulating material for insulating the conductive layer from the inductive element. The conductive layer has a surface substantially identical to the radiation surface.
申请公布号 US7002233(B2) 申请公布日期 2006.02.21
申请号 US20010883438 申请日期 2001.06.18
申请人 KONINKLIJKE PHILIPS ELECTRONICS, N.V. 发明人 BUTAYE BENOIT;GAMAND PATRICE
分类号 H01F17/00;H01L29/00;H01L21/822;H01L23/522;H01L23/64;H01L27/04;H03B5/12;H03H5/12 主分类号 H01F17/00
代理机构 代理人
主权项
地址