发明名称 Semiconductor device
摘要 A semiconductor device has a semiconductor support substrate, a buried insulation film disposed on the semiconductor support substrate, and a single-crystal silicon active layer disposed on the buried insulation film. The buried insulation film has portions which have been removed so that remaining portions of the buried insulating film form buried insulating film island regions. The single-crystal silicon active layer has portions which have been removed so that remaining portions of the single-crystal silicon active layer form single-crystal silicon active layer island regions defining single-crystal silicon resistors of a resistance circuit.
申请公布号 US7002235(B2) 申请公布日期 2006.02.21
申请号 US20030395675 申请日期 2003.03.24
申请人 SEIKO INSTRUMENTS INC. 发明人 HASEGAWA HISASHI
分类号 H01L27/01;H01L27/04;H01L21/02;H01L21/822;H01L21/8234;H01L21/84;H01L27/06;H01L27/08;H01L27/12;H01L27/13;H01L29/00;H01L29/786 主分类号 H01L27/01
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