发明名称 |
Substrate processing apparatus and method, and gas nozzle for improving purge efficiency |
摘要 |
A substrate processing apparatus capable of efficiently purging not only a process space but also the inside of a processing gas feed nozzle when a multi element compound film is formed on a substrate by laminating a molecular layer thereon, wherein an exhaust line is connected to one end of the processing gas feed nozzle jetting the processing gas in a laminar flow into the process space along the surface of the treated substrate, and the processing gas or purge gas is fed from the other end thereof.
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申请公布号 |
US2006032445(A1) |
申请公布日期 |
2006.02.16 |
申请号 |
US20050233093 |
申请日期 |
2005.09.23 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
SHINRIKI HIROSHI;SUZUKI MIKIO |
分类号 |
C23C16/00;C23C16/44;C23C16/455;C23F1/00;H01L21/00;H01L21/31 |
主分类号 |
C23C16/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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