发明名称 Substrate processing apparatus and method, and gas nozzle for improving purge efficiency
摘要 A substrate processing apparatus capable of efficiently purging not only a process space but also the inside of a processing gas feed nozzle when a multi element compound film is formed on a substrate by laminating a molecular layer thereon, wherein an exhaust line is connected to one end of the processing gas feed nozzle jetting the processing gas in a laminar flow into the process space along the surface of the treated substrate, and the processing gas or purge gas is fed from the other end thereof.
申请公布号 US2006032445(A1) 申请公布日期 2006.02.16
申请号 US20050233093 申请日期 2005.09.23
申请人 TOKYO ELECTRON LIMITED 发明人 SHINRIKI HIROSHI;SUZUKI MIKIO
分类号 C23C16/00;C23C16/44;C23C16/455;C23F1/00;H01L21/00;H01L21/31 主分类号 C23C16/00
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