发明名称 INSPECTION METHOD AND SYSTEM FOR COMPONENT MOUNTING SUBSTRATE, INSPECTION METHOD OF SOLDER PRINTING CONDITION FOR COMPONENT MOUNTING SUBSTRATE, AND MANUFACTURING METHOD OF COMPONENT MOUNTING SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To inspect the result of processes in each step with high accuracy while reducing a cost, in a series of steps executed for substrate manufacturing. <P>SOLUTION: On a production line for component mounting substrate, an inspection machine 1 is provided to each process, and further each inspection machine 1 is allowed to communicate mutually with other machines via a network line 2. Each inspection machine 1 can generate an X-ray transmission image to carry out an inspection, and is set to store an image for inspection generated by itself. Each inspection machine 1 (a solder printing inspection machine 1B, a component mounting inspection machine 1C and a soldering inspection machine 1D) other than a forehand bare substrate inspection machine 1A is provided with the image for inspection for the inspected substrate from the inspection machine of the former step, 1A, 1B, and 1C, respectively. Then a differential image of the provided image for inspection and an image for inspection created by the machine itself is created, and inspection is executed by using the image of a to-be-inspected part remaining on the differential image. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006049845(A) 申请公布日期 2006.02.16
申请号 JP20050184416 申请日期 2005.06.24
申请人 OMRON CORP 发明人 KURIYAMA ATSUSHI;ISHIBANE MASATO;MURAKAMI KIYOSHI;YOTSUYA TERUHISA
分类号 H05K3/34;G01N23/04;H01L21/66;H05K13/08 主分类号 H05K3/34
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