| 摘要 |
In a method according to one embodiment, a first and second set of alignment marks are etched into a first side of the substrate. The first set of alignment marks are at location(s) such that they will appear in the object windows of front-to-backside alignment optics of a first lithographic apparatus, and the location(s) of the second set of alignment marks are selected according to an arrangement of alignment apparatus in another lithographic apparatus. The substrate is turned over, aligned using the first set of alignment marks and front-to-backside alignment optics and third and fourth set of alignment marks are etched into the substrate, directly opposite the second and first sets of alignment marks, respectively.
|
