发明名称 THREE-DIMENSIONAL CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To form a circuit with a patterning method using the electromagnetic wave such as laser at the internal surface of an insulating base material in the three-dimensional shape such as a cylindrical shape. SOLUTION: The circuit 8 is formed by forming a conductive layer 2 to the external surface of a base material 1 for transfer, and then partially removing the conductive layer 2 through irradiation of the electromagnetic wave to the conductive layer 2. After the insulating base material 4 is formed by joining the circuit 8 to the external surface of the base material 1 for transfer in the side where the circuit 8 is formed, the base material 1 for transfer is removed while the circuit 3 joined to the insulating base material 4 is left. The pattern of the circuit 8 is formed by irradiating the electromagnetic wave to the conductive layer 2 from the external side of the base material for transfer 1. The circuit 8 can be formed to the internal surface of the insulating base material 4 of the three-dimensional shape such as cylindrical shape by removing the base material 1 for transfer, under the condition that the circuit 8 is left to the insulating base material 4 forming the base material 1 for transfer 1 at the surface thereof. As a result, the circuit can be formed at the internal surface of the insulating base material 4 in the three-dimensional shape with the patterning method using the electromagnetic wave. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006049574(A) 申请公布日期 2006.02.16
申请号 JP20040228547 申请日期 2004.08.04
申请人 MATSUSHITA ELECTRIC WORKS LTD;SHINNO TOSHIKI 发明人 SUZUKI TOSHIYUKI;SHINNO TOSHIKI;IKEDA JUNJI
分类号 H05K3/20 主分类号 H05K3/20
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