| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device exhibiting excellent reliability by preventing fatigue fracture without increasing power consumption and without increasing manufacturing cost due to increase in man-hour. SOLUTION: The semiconductor device 1 comprises a semiconductor element 2, a circuit metal plate 5 and an insulating plate 7 wherein the semiconductor element 2 is bonded to one major surface of the circuit metal plate 5 through braze filler, the insulating plate 7 is bonded to the other major surface of the circuit metal plate 5 through braze filler, a first braze filler layer 4 is formed between the semiconductor element 2 and the circuit metal plate 5, and a second braze filler layer 6 is formed between the circuit metal plate 5 and the insulating plate 7. Furthermore, a rigid plate 3 having an opening 3a capable of surrounding the semiconductor element 2 is provided and bonded to one major surface of the circuit metal plate 5 through braze filler while surrounding the semiconductor element 2 by the opening 3a. COPYRIGHT: (C)2006,JPO&NCIPI
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