| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To suppress the extrusion of thermosetting resin paste to the minimum by solving the problem, wherein since thermosetting resin paste is centralized in the neighborhood of the center of the outer periphery of a semiconductor bare chip and extruded by almost 1.0 mm in semiconductor bare chip mounting by the thermosetting resin paste using a conventional pressing device, peripheral components cannot be mounted inside this, and the miniaturization of module components is hindered. <P>SOLUTION: In this pressing device, a pressing tool 1 whose section positioned in the neighborhood of the center of the outer periphery of a semiconductor bare chip 2 is turned into a low-temperature section 1b is used so that, when heat and a pressure are added to the semiconductor bare chip 2, the increase in the temperature can be reduced in the neighborhood of the center of the outer periphery of the semiconductor chip 2, and the viscosity of resin paste 3 can be made higher than a section to be heated. Thus, flow can be suppressed, and extrusion can be reduced, and peripheral components more adjacent to the semiconductor chip 2 than a conventional manner can be mounted, and to further miniaturize module components. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
