| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser cutting method for cutting a glass for enabling improvement of processing precision and processing speed, in which a first laser is cast along a cutting line for modification by using very high frequency pulse laser and a second laser is cast to a modified part for cutting. <P>SOLUTION: In the cutting and processing method of glass, a crack is generated by a heat source using a processing start point provided on a work made of glass as a starting point, and the crack is extended along a planned cutting line. The first laser is irradiated to the processing start point so as to modify a glass main component of SiO<SB>2</SB>to Si or Si<SB>x</SB>O<SB>y,</SB>or to generate the modified part containing free radicals of B, Na, K, Ca, Zn, Al or Pb from at least one component of glass such as B<SB>2</SB>O<SB>3</SB>, Na<SB>2</SB>O, K<SB>2</SB>O, CaO, B<SB>2</SB>O<SB>2</SB>, ZnO, Al<SB>2</SB>O<SB>3</SB>, PbO or the like. The second laser is cast to the modified part so that the modified part absorbs light energy and discharges thermal stress energy resulting from local thermal expansion so as to cut the glass. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
