| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic circuit substrate capable of suppressing the disconnection of a drawing line of a land in which an electronic component is bonded with lead-free solder. SOLUTION: The ceramic circuit substrate bonding an electrode 1b of an electronic component 1 to a land 2b with lead-free solder 3 is characterized in that a drawing line 2c is prepared in the land 2b, an expanding width 2e equivalent to the land 2b in width is prepared in this drawing line 2c, and a resist film 2d composed of insulators such as glass or the like is piled up to the expanding width portion 2e. COPYRIGHT: (C)2006,JPO&NCIPI
|
