| 摘要 |
A chemical solution coating method includes: a first step of disposing a semiconductor substrate on a substrate supporting unit with a first face to be coated with a chemical solution facing upward; a second step of moving a chemical solution spraying member for spraying the chemical solution to an initial position which is positioned in the vicinity of the first face of the semiconductor substrate and where the chemical solution is to be applied; and a third step of moving the chemical solution spraying member from the initial position in accordance with a predetermined travel pattern and, simultaneously, spraying the chemical solution from the chemical solution spraying member toward the first face of the semiconductor substrate. |
