MANUFACTURING METHOD OF WIRING CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method for efficiently manufacturing a highly reliable wiring board. SOLUTION: A plated layer 15 is formed in a thickness less than 0.1μm by conducting first non-electrolytic plating processing to a wiring pattern 12 formed on a base board 10 utilizing a plating solution 20 including at least one of thiourea and its derivative. The base board 10 is washed using a solvent 30 including amine. A resist layer 40 is formed partially covering the plated layer 15 to the base board 10. Second non-electrolytic plating processing is conducted to an area exposed from the resist layer 40 in the plated layer 15. Heating processing is not conducted between a first non-electrolytic plating process and a forming process of the resist layer 40. COPYRIGHT: (C)2006,JPO&NCIPI