| 摘要 |
Method for manufacture of system support for electronic component (3), e.g. integrated circuit, which contains two semiconductor chips (11,17), with first one (11) embedded in plastics body (13). Through contacts (6) in body extend from first top wiring layer (14) to second, lower wiring layer (18).Through contacts are widened at transition to second wiring layer. Second semiconductor chip (17) comprises contacts (22) for contacting first wiring layer. Preferably through contacts are copper rods. Independent claims are included for electronic component and use of component positions in columns and lines. |
