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发明名称
A METHOD OF FORMING INTERMETAL DIELECTRIC LAYER FOR PREVENTING VOID
摘要
申请公布号
KR100547242(B1)
申请公布日期
2006.02.01
申请号
KR19990060572
申请日期
1999.12.22
申请人
发明人
分类号
H01L21/31
主分类号
H01L21/31
代理机构
代理人
主权项
地址
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