发明名称 Heat exchange apparatus for a metal mold
摘要 A heat exchange apparatus for a metal mold is provided, which includes a heat exchange passage provided for the metal mold, a first supply unit for supplying hot heat carrier to the heat exchange passage and a second supply unit for supplying cold heat carrier to the heat exchange passage. The heat exchange apparatus performs heat exchange for the metal mold by supplying the hot heat carrier and cold heat carrier to the heat exchange passage switching alternately. And the heat exchange apparatus has a feature that it includes an air supply unit for supplying air to the heat exchange passage so that the heat carriers are purged when the hot heat carrier and cold carrier are switched.
申请公布号 US6991756(B2) 申请公布日期 2006.01.31
申请号 US20020284311 申请日期 2002.10.31
申请人 FUJI PHOTO FILM CO., LTD. 发明人 SAEKI TATSUHIKO;WATANABE SEIICHI
分类号 B29C33/04;B29C45/73;B29C35/00;B29C49/48 主分类号 B29C33/04
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