发明名称 PROBE CARD QUALITY EVALUATION METHOD, ITS APPARATUS, AND PROBE INSPECTION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a probe card evaluation method, its apparatus, and a probe inspection method which allow to bring a probe pin of a probe card into contact with an electrode pad of a circuit element reproducibly. SOLUTION: After coarsely adjusting the position of a support stage 11 by alignment, the probe pin 32 is moved with respect to the surface forming an electrode pad 92 of an IC chip 90 horizontally (in the X direction and Y direction) to determine the coordinates of the support stage in the X direction and Y direction when the probe pin 32 falls from the electrode pad 92. From the determined coordinates, then, the range of coordinates of the support stage 11 which allows all the probe pins 32 to be brought into contact with corresponding electrode pads 92 is obtained. The center of the obtained range of coordinates is calculated to decide it to be the optimum contact point. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006023229(A) 申请公布日期 2006.01.26
申请号 JP20040203089 申请日期 2004.07.09
申请人 SEIKO EPSON CORP 发明人 ITO HIDETOMO
分类号 G01R1/06;G01R1/073;H01L21/66 主分类号 G01R1/06
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