| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive material having a conductive core region containing copper and an interface region, and to provide a manufacturing method of the conductive material. SOLUTION: The conductive material comprises a conductive core region containing copper, and one or more metal selected from iridium, osmium, and rhenium in terms of atomic percentage of 0.001 to 0.6, and an interface region. The interface region contains one or more metal in terms of at least 80 atomic percentage or more. In the interface region, a seed layer containing copper, and one or more metal selected from iridium, osmium, and rhenium is formed, and a conductive layer composed of copper is formed thereon. Then, by polishing the conductive layer, a surface material of a polished copper is constituted. Thus, the conductive material is formed by annealing the polished surface material of copper at a sufficient temperature for causing migration of one or more metals from the seed layer to the polished surface. COPYRIGHT: (C)2006,JPO&NCIPI |
