| 摘要 |
A mechanism for protecting an electronic component from electrostatic discharge (ESD) and electrical overstress (EOS) damage. The protective device includes a substrate that is adapted for coupling to a cable and/or another device, e.g., a card, the electronic component (a multi-element magnetic tape head or disk head, etc.), etc. Multiple sets of crossed diodes are coupled to the substrate. Contact leads are coupled to the substrate, and are in electrical communication with the sets of diodes. The diode(s) provide current shunting in the event of an ESD, EOS or other power surge, thereby protecting the electronic component from damage.
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