| 摘要 |
An apparatus for dispensing a liquid or encapsulating a semiconductor device package on a tape is disclosed. The apparatus comprises: a dispensing station for dispensing a liquid encapsulant on the tape; a tape transfer station; a cover film attaching station for attaching a cover film to the tape to screen windows of the tape; and a cover film detaching station. The cover film is automatically attached to and separated from the tape by the cover film attaching station and the cover film detaching station. The apparatus prevents the liquid from flowing under the tape. In addition, a method for encapsulating a semiconductor device package having a tape is disclosed. |
