Bonding method and bonding apparatus

摘要

Disclosed are a bonding method for a semiconductor chip, which employs an ultrasonic bonding scheme that prevents wear-out of the top surface of a mount tool and ensures both high reliability and high productivity, and a bonding apparatus which is used to carry out the method. The bonding apparatus and method are provided with means for suppressing generation of a sliding friction. The apparatus and method execute a bonding process by controlling vibration-axial directional holding force and inertial force based on information given from control management means to thereby maintain a relationship of <?in-line-formulae description="In-line Formulae" end="lead"?>(vibration-axial directional holding force)>(die shear strength)+(inertial force) <?in-line-formulae description="In-line Formulae" end="tail"?> while applying an ultrasonic vibration to a region which is subjected to bonding.