发明名称 Device with thermoelectric cooling
摘要 Increasing the output signal from CPP GMR devices by increasing the read current has not previously been considered an option because it would make the device run too hot. This problem has been overcome by using, for the upper and lower leads, materials that differ significantly in their thermoelectric powers. Thus, when DC is passed through the device, from - to + TEP leads, hot and cold junctions are formed and heat is transferred from the micro-device into the leads, resulting in a net local cooling of the device which enables it to operate at higher power. For a GMR device, this translates to a larger output voltage, making it easier, more sensitive, and more reliable to use.
申请公布号 US6987650(B2) 申请公布日期 2006.01.17
申请号 US20030443358 申请日期 2003.05.22
申请人 HEADWAY TECHNOLOGIES, INC. 发明人 LIU YUE;JU KOCHAN;CHANG JEI-WEI;CHEN JULIE
分类号 G11B5/39;F25B21/02;F25D23/12;H01L35/20;H01L35/28;H01L35/30;H01L35/32;H01L43/08 主分类号 G11B5/39
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