| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive paste with extremely high moisture resistance, capable of obtaining a cured matter maintaining good conductivity for a long period, and with a long pot life, as well as a multilayer substrate using the same. SOLUTION: The conductive paste is used containing (B) metal powder by 1,300 to 2,400 parts by weight consisting of two or more kinds of metal containing at least a kind of low-melting-point metal with a melting point of 180°C or less and at least a kind of high-melting-point metal with a melting point of 800°C or more, (C) a curing agent by 0.5 to 40 parts by weight, and (D) flux by 0.3 to 110 parts by weight to (A) 100 parts by weight of resin components containing ethylene glycol denatured epoxy resin. COPYRIGHT: (C)2006,JPO&NCIPI |
