| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for semiconductor device that is suppressed in the warping of a metallic plate, and also to provide a semiconductor device that is reduced in the stress applied to a semiconductor element and improved in heat radiating property and reliability. SOLUTION: The package for semiconductor device is provided with the metallic plate 101 having a placing section 106 to which the semiconductor element is fixed on one main surface, a resin-containing molded body 102 which is fixed to one main surface of the metallic plate 101 and has an opening 109 formed through the molded body 102 in the thickness direction at the position corresponding to the placing section 106, and a wiring pattern 103 provided on the surface of the molded body 102 on the side opposite to the metallic plate 101. The package is also provided with lead terminals 104 electrically connected to the wiring pattern 103, and a resin-containing cap 105 which is joined to the resin-containing molded body 102 so as to cover the opening 109. COPYRIGHT: (C)2006,JPO&NCIPI |
