发明名称 |
Klebstofffilm zum Herstellen einer Halbleitereinrichtung |
摘要 |
An adhesive film for manufacturing a semiconductor device comprising a thermosetting adhesive layer and a heat-resistant backing layer, wherein the adhesive film is applied to a method for manufacturing a semiconductor device, comprising the steps of (a) embedding at least a part of a conductor in the adhesive film to form a conductor adhered thereto; (b) mounting a semiconductor chip on the conductor; (c) connecting the semiconductor chip to the conductor; (d) encapsulating the semiconductor chip with an encapsulation resin; and (e) removing the adhesive film therefrom. The adhesive film can be suitably used for manufacturing a semiconductor device having a so-called standoff wherein a part of a conductor is projecting from an encapsulation resin. |
申请公布号 |
DE102004060922(A8) |
申请公布日期 |
2006.01.12 |
申请号 |
DE20041060922 |
申请日期 |
2004.12.17 |
申请人 |
NITTO DENKO CORP., IBARAKI |
发明人 |
HOSOKAWA, KAZUHITO;OKEYUI, TAKUJI;IKEMURA, KAZUHIRO;YOSHIKAWA, KEISUKE |
分类号 |
H01L23/50;C09J5/04;H01L21/50;H01L21/56;H01L21/60;H01L21/68;H01L23/31 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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