| 摘要 |
<p>A power amplifier and duplexer composite device for improving an impedance matching is provided to form impedance matching portions at an internal layer of a substrate in spiral shape, thereby reducing a size of strip lines, consequently miniaturization can be realized while a parasitic effect is reduced. A substrate(PCB) is laminated by plural dielectric layers. Coupling portions(43) are formed as conductive patterns in portions of the plural dielectric layers, and are connected between a power amplifier(41) and a duplexer(44) to reduce a transmission power received from the power amplifier(41). Impedance matching portions(45) are formed as spiral-shaped conductive patterns in portions of at least two layers of the plural dielectric layers to be mutually connected, and are connected between a receiving filter of the duplexer(44) and an antenna end for impedance matching between the receiving filter and a transmission filter of the duplexer(44).</p> |
