发明名称 Methods of forming semiconductor fuse arrangements
摘要 The invention includes semiconductor fuse arrangements containing an electrically conductive plate over and in electrical contact with a plurality of electrically conductive links. Each of the links contacts the electrically conductive plate as a separate region relative to the other links, and the region where a link makes contact to the electrically conductive plate is a fuse. The invention also includes methods of forming semiconductor fuse arrangements.
申请公布号 US6984549(B1) 申请公布日期 2006.01.10
申请号 US20040922492 申请日期 2004.08.19
申请人 MICRON TECHNOLOGY, INC. 发明人 MANNING H. MONTGOMERY
分类号 H01L21/82 主分类号 H01L21/82
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