发明名称 PLATING OF BRAZED RF CONNECTORS FOR T/R MODULES
摘要 Slots or apertures are formed in the connector shroud of a T/R module in a plane perpendicular to the axis of the connector so as to allow plating solution to flow freely through the entire inner portion of the connector, particularly the rear portion, during fabrication of the T/R module. The slots are formed prior to the shroud being brazed on to the module substrate. By allowing plating solution to flow through the connector, the interior of the connector can be more thoroughly plated, thereby improving the yield of the assembly while reducing cost.
申请公布号 US2006003642(A1) 申请公布日期 2006.01.05
申请号 US20040879042 申请日期 2004.06.30
申请人 RICHARD PATRICK K;RICH EDWARD L III;EBERSOLE KEVIN L;MARTIN ANGELA J;GUPTA TAPAN K;STRACK DAVID W;FISHER JOHN S III 发明人 RICHARD PATRICK K.;RICH EDWARD L.III;EBERSOLE KEVIN L.;MARTIN ANGELA J.;GUPTA TAPAN K.;STRACK DAVID W.;FISHER JOHN S.III
分类号 H01R13/73;H01R4/02;H01R13/00;H01R13/03;H01R13/646 主分类号 H01R13/73
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