| 摘要 |
A backlight unit is provided with LEDs having a cooling structure. The backlight includes a heat pipe, which is disposed below a PCB having the LEDs thereon, and a heat sink connected with the heat pipe. Heat generated from the LEDs conducts via the PCB and the heat pipe and is then radiated by the heat sink. The cooling performance of the backlight unit is thus enhanced and the temperature increase in the light emission region is thus suppressed, so that thermal reliability of the LEDs is enhanced and light efficiency is increased to increase the brightness and to decrease the power consumption.
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