| 摘要 |
PROBLEM TO BE SOLVED: To realize high throughput, while preventing stagnation of substrates in a substrate-processing chamber by employing an in-line type semiconductor manufacturing system. SOLUTION: The in-line type semiconductor production system comprises a plurality of substrate-processing modules MD, having a vacuum robot VR, and an atmospheric loader LM having one atmospheric robot AR. The substrate processing module consists of a process chamber PM and a vacuum lock chamber VL. When a processed wafer is transferred from the chamber PM to the chamber VL, a control means CNT controls the operation to transfer a yet to be processed wafer from a load port LP to the atmospheric loader LM, in parallel with a process where the chamber VL is returned from vacuum pressure back to the atmospheric pressure, and to align the yet to be processed wafer by means of an aligner unit AU before it is waited in front of the chamber VL. Upon finishing cooling of the processed wafer, the waiting yet to be processed wafer is carried into the chamber VL and the processed wafer is carried out onto the load port LP. COPYRIGHT: (C)2006,JPO&NCIPI
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