| 摘要 |
PROBLEM TO BE SOLVED: To provide an etching composition for completely removing such a metallic content as to deposit on a part other than a wiring pattern and cause the lowering of insulation reliability, without eroding the surface of the wiring pattern formed of a layer of a conductor such as copper. SOLUTION: The composition for etching, which selectively removes a metal except copper and a copper alloy, is an aqueous solution including (1) hydrochloric acid of 10 to 300 g/l in terms of HCl, (2) nitric acid of 1 to 100 g/l in terms of HNO<SB>3</SB>, (3) phosphoric acid of 1 to 100 g/l in terms of H<SB>3</SB>PO<SB>4</SB>, (4) at least one compound selected from the group consisting of nitrous acid and a salt thereof, in an amount of 0.001 to 10 g/l in terms of NO<SB>2</SB>, and (5) a surfactant of 0.01 to 50 g/l. COPYRIGHT: (C)2006,JPO&NCIPI
|
