SURFACE MOUNTING ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

摘要

An electronic component is provided with at least a pair of electrode terminal pieces (2, 3) and a semiconductor element (4) electrically connected with the pair of electrode terminal pieces, and is entirely sealed by a synthetic resin package body (6) so as to expose a part of a lower plane of the electrode terminal pieces from a lower plane of the package body. On side planes of the package body, synthetic resin film layers (11) are formed to cover cut planes at leading edges of connecting lead pieces integrally extending outward from the electrode terminal pieces, and a trouble caused by exposing the cut planes at the leading edges of the connecting lead pieces is eliminated.