ORGANIC SEMICONDUCTOR ELEMENT

摘要

An organic semiconductor element part formed on a board is covered with a planarizing layer, and a heat sink is fixed on the planarizing layer by an adhesive layer. Between the adhesive layer and the planarizing layer, a shield layer is formed to shield the organic semiconductor element part against adverse effects at the time of hardening the adhesive layer. In the case where the adhesive layer is a photocuring layer, the shield layer preferably blocks light used for hardening the photocuring adhesive layer. In the case where the adhesive layer is a thermosetting adhesive layer, the shield layer preferably blocks outgas generated at the time of hardening the thermosetting adhesive layer. Thus, oxygen, water and the like can be surely blocked, and heat can be efficiently dissipated. Furthermore, adverse effects upon adhering the heat sink can be suppressed, and deterioration of the organic semiconductor element part (organic EL element) can be controlled.