A PACKAGE FOR MICROCHIPS

摘要

A package (1) for protecting an integrated circuit device (11) having an active side. The package includes a substrate (5) for mounting the integrated circuit device (11) and a plastic cap (3) mounted on the substrate (5) to form an enclosed space for the active side of the integrated circuit device. A thermal bond (13) is formed between the substrate (5) and the plastic cap (3) to effectively seal the enclosed space so as to prevent the ingress of moisture or particulate.