SUBSTRATE CLEANING METHOD AND COMPUTER READABLE RECORDING MEDIUM

摘要

A wafer (W) is treated by supplying two-fluid or high-pressure jet water or megasonic water, while rotating the wafer (W) almost horizontally. After stopping supply of such cleaning fluids, without performing rinse treatment with pure water, the wafer (W) is rotated at a higher speed than that when the cleaning fluids are supplied, and the water (W) is dried.