| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrooptical device and electronic equipment that can prevent a conductive pattern from corroding and where an inspection pad that an inspection probe can be made to abut against can be arranged even if a package body like IC is made small in size. SOLUTION: The electrooptical device includes a plurality of conductive patterns 8 each having: a package pad 65 formed by stacking a 1st conductive layer 32a, an insulating layer 32b, and a 3rd conductive layer 34b in this order, the outermost surface layer being formed of the 3rd conductive layer 34b; an inspection pad 82 formed by stacking a 1st conductive layer 32a, an insulating layer 32b, and a 3rd conductive layer 43b in this order outside a package region of the package body 4 at a position adjacent to the formation region of the package pad 65, the outermost surface layer being formed of the 3rd conductive layer 34b; and a lead-around part formed by stacking a 1st conductive layer 32a and an insulating layer 32b in this order at a part extended from the inspection pad 82, the outermost surface layer being the insulating layer 32b. The electrooptical device is used for the electronic appliance. COPYRIGHT: (C)2006,JPO&NCIPI |
