摘要 |
An electroplating bath, a system, a process for, and the article obtained from, depositing a zinc-nickel ternary or higher alloy, a) zinc ions; b) nickel ions; and c) one or more ionic species selected from ions of Te<+4>, Bi<+3> and Sb<+3>, and in some embodiments, further including one or more additional ionic species selected from ions of Bi<+3>, Sb<+3>, Ag<+1>, Cd<+2>, Co<+2>, Cr<+3>, Cu<+2>, Fe<+2>, In<+3>, Mn<+2>, Mo<+6>, P<+3>, Sn<+2> and W<+6>. In some embodiments, the system includes a divider (116, 216, 316, 416) forming a cathodic chamber (114, 214, 314, 414) and an anodic chamber (112, 212, 412), with the electroplating bath in the cathodic chamber (114, 214, 314, 414) only. In various embodiments, the zinc-nickel ternary and higher alloys may provide improved properties to the conductive substrates upon which the alloys are deposited.
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申请人 |
ATOTECH DEUTSCHLAND GMBH;CAPPER, LEE, DESMOND;OPASKAR, VINCENT, C.;WYNN, PAUL, CHRISTOPHER;BISHOP, CRAIG, V. |
发明人 |
CAPPER, LEE, DESMOND;OPASKAR, VINCENT, C.;WYNN, PAUL, CHRISTOPHER;BISHOP, CRAIG, V. |